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Introduction of specimen cutting machine
SYJ-400Â is a CE certified precise dicing and cutting solution for R&D Lab in Materials and Microelectronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components. The EC-400 saw can
be computerized with position accuracy of 0.01 mm. The sample stage with two angles adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance. Laptop with software and USB cable are installed.
Technical parameter of specimen cutting machine
Â
Voltage
AC 110V or AC 220V +/- 10%
 Motor
Brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm.Â
Power consumption: 180W
Effective Cutting Range
3 dimension: Â X-axis: 8"Â Â Â Â Â Y-axis:4"Â Â Â Â Â Â Â Z-axis:4"
Moving/Cutting Speed Range
X-axis: 1-50mm/min adjustable
Y-axis: 1-50mm/min adjustable
Z-axis: 1-20mm/min adjustable
Accuracy
0.0025 mm moving resolution and 0.01 mm position accuracy.
Cutting Blades Kits
One 4" Dia x, 0.35 mm thick fully sintered diamond blade Â
Two pairs of flanges with 62 mm Dia. ( for dicing ) and 42 mm Dia. (for deep cutting)
PC Software
Laptop and PC software are provided with the equipment.Â
Cutting parameters can be set in software as cutting length, width, diameter, time, feed speed, kerf loss, etc
Manual or programmable control mode     Â
Water Cooling
Assemblies of water jetting, draining, and Transparent plastic splashing protection is included.
Accessories
Complete accessories are included for immediate use, including 120L/min Oilless vacuum pump,Â
4" diamond blade and sample holder.etc.
One vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419).are included for dicing the thin wafer
Optionals
For longer wire life, please use LubeCool -150 Smart Solid Lubricant and Coolant
For better lighting, please consider a Fiber Optic Y-shape Dual Light Microscope Illuminator
In order to ensure accurate alignment when cutting the wafer, you should choose 25x stereo microscope with support frameÂ
For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider using 100 microns ultra-thin diamond blade because of fewer kerfs.                  Â
Net WT& DIMEN
Net Weight: 33.5 kgÂ
580 L x 560Â W x 660Â H (mm)Â
Shipping WT & DIMEN
Shipping weight: 170 lbsÂ
48"L x 40"W x 37"H (inch)Â
Warranty & Compliance
One year limited with lifetime supportÂ
More photos of specimen cutting machine
Â
Introduction of specimen cutting machine
SYJ-400Â is a CE certified precise dicing and cutting solution for R&D Lab in Materials and Microelectronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components. The EC-400 saw can
be computerized with position accuracy of 0.01 mm. The sample stage with two angles adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance. Laptop with software and USB cable are installed.
Technical parameter of specimen cutting machine
Â
Voltage
AC 110V or AC 220V +/- 10%
 Motor
Brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm.Â
Power consumption: 180W
Effective Cutting Range
3 dimension: Â X-axis: 8"Â Â Â Â Â Y-axis:4"Â Â Â Â Â Â Â Z-axis:4"
Moving/Cutting Speed Range
X-axis: 1-50mm/min adjustable
Y-axis: 1-50mm/min adjustable
Z-axis: 1-20mm/min adjustable
Accuracy
0.0025 mm moving resolution and 0.01 mm position accuracy.
Cutting Blades Kits
One 4" Dia x, 0.35 mm thick fully sintered diamond blade Â
Two pairs of flanges with 62 mm Dia. ( for dicing ) and 42 mm Dia. (for deep cutting)
PC Software
Laptop and PC software are provided with the equipment.Â
Cutting parameters can be set in software as cutting length, width, diameter, time, feed speed, kerf loss, etc
Manual or programmable control mode     Â
Water Cooling
Assemblies of water jetting, draining, and Transparent plastic splashing protection is included.
Accessories
Complete accessories are included for immediate use, including 120L/min Oilless vacuum pump,Â
4" diamond blade and sample holder.etc.
One vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419).are included for dicing the thin wafer
Optionals
For longer wire life, please use LubeCool -150 Smart Solid Lubricant and Coolant
For better lighting, please consider a Fiber Optic Y-shape Dual Light Microscope Illuminator
In order to ensure accurate alignment when cutting the wafer, you should choose 25x stereo microscope with support frameÂ
For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider using 100 microns ultra-thin diamond blade because of fewer kerfs.                  Â
Net WT& DIMEN
Net Weight: 33.5 kgÂ
580 L x 560Â W x 660Â H (mm)Â
Shipping WT & DIMEN
Shipping weight: 170 lbsÂ
48"L x 40"W x 37"H (inch)Â
Warranty & Compliance
One year limited with lifetime supportÂ
More photos of specimen cutting machine
Â
Precision CNC Specimen Cutting Machine with Accessories
Model NO.: CY-SYJ-400
Precision: Precision
Certification: CE, TUV
Condition: New
Accuracy: 0.0025mm
X-Axis: 1-50mm/Min
Y-Axis: 1-50mm/Min
Z-Axis: 1-20mm/Min
Name: Specimen Cutting Machine
Warranty: One Year
Trademark: CY
Transport Package: Wooden Box
Specification: dia. 100mm
Origin: Zhengzhou, China
HS Code: 8464101000
Model NO.: CY-SYJ-400
Precision: Precision
Certification: CE, TUV
Condition: New
Accuracy: 0.0025mm
X-Axis: 1-50mm/Min
Y-Axis: 1-50mm/Min
Z-Axis: 1-20mm/Min
Name: Specimen Cutting Machine
Warranty: One Year
Trademark: CY
Transport Package: Wooden Box
Specification: dia. 100mm
Origin: Zhengzhou, China
HS Code: 8464101000