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The high-performance microfocus X-ray tube developed by Viscom is the heart of the X705 technology's X-ray technology, ensuring a resolution of 15 microns per pixel. The iterative Easy3D software also provides high-accuracy image quality. Thus, the complex overlapping portions of the printed circuit board can be decomposed and produce features that are easy to analyze. By integrating 6 megapixel sensor technology, the X7056 offers the largest inspection depth of any Viscom system at maximum productivity. In particular, the X7056 can be equipped with an AOI camera for simultaneous detection of the top and bottom of the PCB.
The high-performance bonding system features top and bottom optical inspection and X-ray inspection, setting a new standard for quality assurance. Synchronous detection and dual loading enable fast detection and minimal processing time. The X7056 is completely modular, so it can be used as an AOI/AXI combination system or a pure AXI system. These different inspection concepts provide the ultimate flexibility to meet customer needs.
Other features include the fast program generation capabilities of Viscom EasyPro software and Viscom's full range of detection algorithms. The X7056's hardware and software are fully compatible with all AOI systems. The optional high performance VPC software module utilizes multiple filter functions to adjust process monitoring and process optimization.
Viscom's new X7056 automatic 3D X-ray inspection system
Viscom's long-awaited solution with true parallel detection capabilities - the Viscom X7056 sets a new standard for optical and X-ray combined inspection. Automated Optical Inspection (AOI) has a worldwide reputation. Micro-miniature components such as ball grid arrays (BGAs), micro-ball grid arrays (μBGAs), and chip-scale packages (CSPs) bring more demands to inspection systems to detect and even hide more reliably and cost-effectively Failure - and it has a robust depth of inspection during rapid production. This is the advantage of the new X7056: a high-performance 3D automated X-ray inspection (AXI) system with parallel optical inspection of the top and bottom surfaces to meet the high productivity required for today's electronics production.