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After passing through 2013, I saw the ups and downs in the LED market and the hot spots in just one year. I also saw that the technology market is not far behind, and new technologies and new hot keywords are frequently used. First, COB, HV-LED, eutectic technology, COB sizzling technology market, and then the crystallization of flip-chip, flip-chip, package-free technology, the final LED industry needs mocvd equipment localization, intelligent lighting future, packaging mold Grouping is the future of the entire LED industry. There are indications that the entire LED lighting industry technology is undergoing an unpredictable market test and an unprecedented test. At the end of the year, let us review the top ten technical hotspots worthy of being remembered by history.
Keyword 1, COB
With the decline in the LED market price, the huge market for general lighting applications and the strong demand in the fields of commercial lighting, special lighting, backlighting, etc., promote the unit brightness of LED light sources. The COB package has good performance in horizontal heat dissipation and vertical heat dissipation under a limited volume, and is suitable for achieving greater power in a small area. It has the following advantages:
1, the performance is more superior: the use of cob technology, the chip bare die directly bound to the pcb board, eliminating the need for wire bonding connections, so that product performance is more reliable and stable.
2, higher integration: the use of cob technology, eliminating the link between the chip and the application board, improving the integration of the product.
3, the volume is smaller: the use of cob technology, because it can be bound on the pcb double-sided placement, correspondingly reduce the volume of the cob application module, expanding the application space of the cob module.
4, stronger ease of use, more streamlined product process: the original cluster bus technology is adopted, the use of pins between the cob board and the application board facilitates interconnection, eliminating the need for welding processes such as soldering. It reduces the difficulty of product use, simplifies product flow, and makes the product easier to replace, enhancing product usability.
5, lower cost: cob technology is directly bound on the pcb board, eliminating the need for the cost of the chip, welding and other processing processes, and the design of the user board is more simple, effectively reducing the cost of embedded products .
Keyword 2: HV-LED
HVLED, as its name implies, is a high-voltage LED. Compared with traditional DCLED, it has the advantages of low packaging cost, high warm white light efficiency, high driving power efficiency and low line loss. Specifically:
1. HVLED realizes serial-parallel connection of micro-grains directly at the chip level, which makes it work under low current and high voltage, which will simplify the die-bonding and bonding quantity of the chip and reduce the packaging cost.
2. The HV chip forms multiple micro-die integrations per unit area, which avoids the consistency problem caused by wavelength, voltage and brightness span in the BIN between chips;
3. The HVLED chip is a power chip driven at a small current, and can be integrated with a red LED chip to form a warm white light, which is more efficient than the traditional DCLED red fluorescent powder yellow fluorescent powder. Shorten the gap between LED warm white and cool white packaging, and it is easier to achieve high light source index;